Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computer, automotive, industrial, LED and solar energy.
Die Attach
Besi offers multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders for mass production, stacked die bonders and die sorting equipment.
Packaging
Besi's Packaging product group offers molding, trim & form and singulation systems under the Fico brand name. Fico systems have a proven reputation for innovation, quality, reliability and high volume output.
Plating
Meco manufactures and supplies continuous plating systems to suit the electronics industry. Over the years, these systems have established an international reputation for high performance, outstanding reliability, top quality and unbeatable economy.
Product Categories
101 Photovoltaic Device Manufacturing
- PV: Cells
200 Packaging and Assembly Equipment
- Deflashing; Degating Tools
- Die Bonding; Attach Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
- Dispensing Systems
- Lead Frame Taping Systems
- Molding; Encapsulation; Decapsulation Equipment
- Plating; Electro Chemical Plating for device assembly
- Wafer Level Bonders
206 PV Equipment
- Cells