Primary products are for Semiconductor Manufacturersare Takaori quipment for Semiconductor wafer taping, tape lamination/delamination, application of Dry Resist Films, wafer temporary bonding, wafer mounting uner vacuum.
Products for Wafer manufacturers include wafer sorters, wafer thickness and shape measurement and wafer polishers from Gigamat Technologies, plus wire saws from Takatori for wafer slicing. We are the main supplier for equipment for slicing of hard materials.
Heavily involved in MEMs device lamination using the Takatori TEAM100/300 vacuum lamination system, and in LED production with our taping/mounting systems.
Product Categories
200 Packaging and Assembly Equipment
- Wafer Mount; Taping Equipment
201 Flat Panel Display Equipment
- Polarizer Sticking Equipment
203 Inspection & Measurement Products
- Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
- Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
207 Process Equipment
- Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
- Crystal Growing & Machining Equipment
- SOI Bonders; Temporary Bonders; De-Bonders
307 Process Materials
- CMP; Grind; Lap; Polish; Abrasive materials