EquipNet is the world's most comprehensive surplus asset management company.
Whether it’s surplus asset tracking, equipment redeployment, sales or purchasing second-hand equipment, our broad range of services allows clients to generate a significant amount of previously unidentified funds from assets that have just been sitting idle.
Since 1999, EquipNet has been revolutionizing the way companies manage their surplus assets. In all cases, our clients benefit from hundreds of years of combined experience of our global workforce and an umbrella of support from our Project Managers who make sure that goals are met and deadlines are kept.
Taken individually, our services help customers meet various independent challenges such as having assets that they can no longer user, or needing to buy equipment quickly and economically. When combined, however, our services seamlessly unite to provide a comprehensive surplus asset management program.
Product Categories
200 Packaging and Assembly Equipment
- Backgrind; Slicing; Lapping; Polishing Equipment
- Ball Placement; Attach Systems
- Base Loader Systems
- Cleaning; Washing Equipment for Assembly & Packaging
- Cut & Down Set; Trim; Form Equipment
- Deflashing; Degating Tools
- Device Handling; Feeding Systems
- Dicing; Sawing; Scribing; Separation Equipment
- Die Bonding; Attach Equipment
- Die Removal Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
- Dispensing Systems
- Hot Embossing System
- Lead Finishing; Straightening Equipment
- Lead Frame Taping Systems
- Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
- Marking; Imprinting; Labeling Equipment
- Molding; Encapsulation; Decapsulation Equipment
- Package Handling; Conveying Equipment
- Package Simulation; Characterization Equipment
- Plating; Electro Chemical Plating for device assembly
- Printed and Organic Electronic Equipment
- PROM; Memory Programmer Equipment
- Solder Reflow; Soldering & Brazing Equipment
- Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment
- Wafer Level Bonders
- Wafer Mount; Taping Equipment
- Wire Bonding Equipment
202 Other Equipment
- Cutting; Drilling; Laser ablation; Beveling Equipment
- Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
- Lamination; Sheet Laminating Equipment
- Repair; Rework Equipment
- Sealing; Bagging; Packing Equipment
- Space simulation; Vacuum chambers
- Vacuum drying & out gassing Systems
- Vibration Isolation Systems
- Vision; ID; Bar Code Systems
- Welding Equipment
203 Inspection & Measurement Products
- Air Velocity (VA) Humidity and Moisture Sensing
- Centrifuges
- Chromatograph
- CV (capacitance-to-voltage) Probe systems
- Defect; Particle; Bump; Contamination Detection, Review or Inspection
- Die Inspection; Die Shear
- ESCA; Ultrasonic; Acoustical Microscopes
- Fiber Optic Inspection Instruments
- Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
- Flat; Notch Finding System
- Instruments; Bench Top Test
- Microscopes: Optical Microscopes