ACCRETECH is a world-leading equipment supplier to the semiconductor industry.
Key products are Wafer Probers, Dicing Systems, Dicing Blades, Polish Grinders, Wafer Edge Grinders, High Rigid Grinders and CMP.
Our world-leading Wafer Probers feature highest accuracy, throughput and reliability.
The Stealth Laser Dicing technology was the first in the market for a completely dry, dust-free cutting process for MEMS and other applications.
Our new fully- and semi-automatic 200mm/300mm Twin Spindle Dicers feature high speed, efficiency and reliability at smallest footprint available.
Compact and modular CMP systems with high performance CMP technology built up in volume-production line of semiconductor devices
The ACCRETECH Polish Grinder system achieves wafer thickness down to 15µm including stress release in the same system.
For Si, Sapphire, SiC or GaN wafer manufacturer we can provide the required grinding equipment for complete process flow.
We are looking forward to seeing you at booth!
Product Categories
200 Packaging and Assembly Equipment
- Backgrind; Slicing; Lapping; Polishing Equipment
- Cleaning; Washing Equipment for Assembly & Packaging
- Dicing; Sawing; Scribing; Separation Equipment
- Dispensing Systems
- Wafer Mount; Taping Equipment
202 Other Equipment
- Cutting; Drilling; Laser ablation; Beveling Equipment
203 Inspection & Measurement Products
- Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
207 Process Equipment
- Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
208 Test Equipment
- Probe Card Maintenance and Analysis Systems
- Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers
- Test Head Manipulators and Docking Stations
300 Packaging and Assembly Materials
- Scribe Tools; Saw or Dicing Blades and Accessories
307 Process Materials
- CMP; Grind; Lap; Polish; Abrasive materials
400 Components, Parts & Accessories
- Chucks for Wafer and other Substrates
700 Manufacturing Services
- Repair; Rebuild; Install Equipment; Maintenance Services; Spare Parts
- Sawing; Lapping; Grinding; Polishing Service
- Used; Rental Equipment; Inventory Reduction, Appraisal - Brokers; Resellers
701 Manufacturing Services or Consulting
- Wafer Handling
902 Other
- Other