AEMtec offers a unique spectrum of
high-end chip-level technologies. In our cleanroom facilities (ISO 5, ISO 7 and ISO 8) we apply a broad technological range of chip-on-board, flip chip, SMT, 3D integration and opto-packaging procedures. We work with all common substrates such as standard circuit boards (rigid, rigid-flex), films, ceramics, silicon wafer, glass or IMS.
Multi-chip modules (MCMs) permit full-function realization as well as sub-layouts in the form of a system-in-package (SIP). In this way AEMtec supports modularization concepts and helps reduce manufacturing costs. For instance, AEMtec can accommodate highly integrated components with a large number of I/Os in modules with a very small footprint, without having to implement the entire board as a high-cost HDI circuit board.
Product Categories
300 Packaging and Assembly Materials
- Printed Circuit Boards (PCB); Printed Wire Boards (PWB)
700 Manufacturing Services
- Burn-In Service
- Failure Analysis and other Analytical Services
- Sawing; Lapping; Grinding; Polishing Service
- Wafer Bumping Service
701 Manufacturing Services or Consulting
- Assembly
- CAD; CAM; CIM
- Circuit Design; Electronic Design Services (EDS); System Level Design (SLD)
901 Printed, Organic, Flexible and Large Area
- Device Manufacturing: Electronic
- Device Manufacturing: Integrated systems
- Device Manufacturing: Lighting
- Device Manufacturing: Sensors
- Device Manufacturing: Wearable electronics
- Materials: Substrates, encapsulation, packaging