DISCO is a total solution provider for Dicing (Kiru), Grinding (Kezuru) and Polishing (Migaku) technologies.
< Technology area >
- Wafer dicing by blade, laser or plasma
- Wafer thinning by grinding and polishing (Dry polishing, CMP, etc.)
- Special processes by laser (Please consult with us.)
- Special processes like TAIKO, DBG and KABRA. (See our website.)
- Surface planarization
- Dicing tape and Grinding tape
- Wafer mounter
- Expander / Die separator
- Camtek AOI (Automatic Optical Inspection)
- TECNISCO glass and metal parts
- Dicing Grinding Service and Camtek optical inspection service are available in our cleanroom at Munich office. We accept orders even from a small quantity. Please also visit http://www.dicing-grinding.com/
Product Categories
200 Packaging and Assembly Equipment
- Backgrind; Slicing; Lapping; Polishing Equipment
- Dicing; Sawing; Scribing; Separation Equipment
- Wafer Mount; Taping Equipment
202 Other Equipment
- Cutting; Drilling; Laser ablation; Beveling Equipment
- Lamination; Sheet Laminating Equipment
203 Inspection & Measurement Products
- Defect; Particle; Bump; Contamination Detection, Review or Inspection
300 Packaging and Assembly Materials
- Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
- Scribe Tools; Saw or Dicing Blades and Accessories