SEMICON Europa 2016

Fraunhofer Group for Microelectronics 

Booth 662

Berlin, D-10178,   
      Germany


18 Fraunhofer institutes work together across Germany in order to give you technology and system developments in microelectronics and nanoelectronics as well as microsystem and communication technologies from a single provider.



As Europe’s largest R&D provider for smart systems, we also form a bridge between fundamental research and product development in order to strengthen Germany’s and Europe’s innovativeness considerably.



You will find our near-application developments at:





Our research and development expertise can support you in the following technological transsectoral areas:





We can also help you realize your product ideas with the know-how that our 18 member institutes have of the following core competences:





Technology – Application – Society: Bridging the Gap


Product Categories

308 Substrates
- Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.)
- Diamond substrates
- Epitaxial; Epi; Gettered; Internal Gettered Wafers
- Gallium Arsenide (GaAs); Sapphire Substrates
- Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide;

400 Components, Parts & Accessories
- Sensors

601 Design Software
- CAD - Computer Automated Design
- EDA - Electronic Design Automation; Circuit Design

700 Manufacturing Services
- Certification; Compliance; Independent Laboratories
- Deposition Service
- Etch; Strip; Cleaning Service
- Failure Analysis and other Analytical Services
- Ion Implant Service
- Measurement; Inspection Service

701 Manufacturing Services or Consulting
- Manufacturing Process Support and Development
- Nanotechnology Intellectual Property Development; Research
- Product Development; Software Design; Product Lifecycle Management
- Static; ESD Testing & Control Services

802 Educational; Research Institutions
- Education; Research Institutions (Non Profit); Academia; Schools

903 Electronic Components
- Components: Low Power Electronics
- Components: ASIC's
- Components: Flexible Electronics
- Components: IC's
- Components: MEMS
- Components: Sensors

904 Electronic Applications
- Energy Efficiency: Energy Harvesting Solutions
- Energy Efficiency: High voltage solutions
- Energy Efficiency: Low Power Electronics
- Energy Efficiency: Power electronics
- Energy Efficiency: Power Supplies and Batteries
- Healthcare: Device Implants
- Healthcare: Flexible Intelligent Devices
- Healthcare: sensors
- Imaging: Camera and Camera Modules
- Imaging: CCD, CMOS and organic sensors
- Imaging: Optics and Micromechanic