Logitech Ltd is a world leader in materials processing, shaping and surface finishing technology. We design and manufacture high precision cutting, lapping, polishing and bonding systems which enable high specification surface finishes to be prepared with precise geometric accuracy.
Logitech systems provide exacting standards of material flatness and parallelism and are used to process fibre optic, laser, opto-electronic and semiconductor materials.
Cutting edge Materials Processing
We are unique on our approach with "systems packages", enabling clients to get the best from their application processes. As part of a systems package,, we include a high level of technology transfer and support to provide customers with reliable systems which meet the required specifications.
Our active and continuous policy of new product Development and materials process development. This ensures we effectively support our clients , whilst actively developing new systems and application processes for current and future materials.
Product Categories
200 Packaging and Assembly Equipment
- Backgrind; Slicing; Lapping; Polishing Equipment
- Wafer Level Bonders
307 Process Materials
- CMP; Grind; Lap; Polish; Abrasive materials