EEJA--MANUALAUTOMATICELECTROPLATINGEQUIPMENTWITHPROCESSCHEMISTRYFORSEMICONDUCTORWAFERS,LEDDEVICESPACKAGES.300MMTOOLSFORMULTIMETALDEPOSITION.FLIPCHIP,C4,TABBUMPS,TSVPILLARS--TANAKAKIKINZOKUGROUP--BONDINGWIRE,SPUTTERINGTARGETS,EVAPORATIONASSEMBLYMATERIALS
Product Categories
200 Packaging and Assembly Equipment
- Cleaning; Washing Equipment for Assembly & Packaging
- Plating; Electro Chemical Plating for device assembly
- Wire Bonding Equipment
201 Flat Panel Display Equipment
- Laser Treatment; Cutting Systems for Panels & Photocells
- Panel Alignment; Cell Assembly Equipment
202 Other Equipment
- Cutting; Drilling; Laser ablation; Beveling Equipment
206 PV Equipment
- Thin Film
- Wafers
207 Process Equipment
- Bumping Systems
- Plating; Electro Chemical Plating; Deposition Systems
300 Packaging and Assembly Materials
- Bonding; Interconnect: Wire/Ribbon/Tape/Capillaries/Tools
- Preforms; Lids
- Thick Film Pastes; Materials
301 Chemicals & Solids
- Cleaning Chemicals; Solvents; Strippers
- Other Specialty Chemicals
305 Nanotechnology Materials
- Nanotechnology Materials
306 PV Materials
- Consumables
- Solar Glass, encapsulation
307 Process Materials
- Deposition Supplies
- Plating Materials
400 Components, Parts & Accessories
- Raw Material & Custom components; Metal
- Raw Material & Custom components; Plastic
500 Factory Monitoring & Control Systems (FMCS)
- Process Controls
- Waste Control; Effluent Management Systems
502 Material Handling Systems
- Conveying; Material Handling Systems
700 Manufacturing Services
- Reclaim Services
701 Manufacturing Services or Consulting
- Package Mat'ls; Interconnect; Subassembly Design Svcs