Precision ULTRASONIC MACHINING, Microabrasive Jet Machining, and CNC grinding of advanced materials including CVD SiC, sapphire, alumina, silicon, quartz, glass, ceramic composites, and other hard & brittle materials.
Structured wafers for MEMS applications including MEMS pressure sensors and microfluidic applications.
Single and double side polished borosilicate wafers.
Prototype thru production.
Advanced metrology capabilities.
ISO 9001:2008
Product Categories
200 Packaging and Assembly Equipment
- Backgrind; Slicing; Lapping; Polishing Equipment
202 Other Equipment
- Cutting; Drilling; Laser ablation; Beveling Equipment
307 Process Materials
- CMP; Grind; Lap; Polish; Abrasive materials
- Quartzware, Ceramic & Oxide Ceramic Fixtures
308 Substrates
- Compound Semi substrates (GaAs; GaN; InP; SiGe, etc.)
- Diamond substrates
- Gallium Arsenide (GaAs); Sapphire Substrates
- SOI; Silicon on Sapphire (SOS); Silicon Carbide
- Strained silicon; Engineered Substrates
- Thin & Thick film substrates for MEMS
309 Test Materials
- Probe Cards; DUT boards and other probing accessories
400 Components, Parts & Accessories
- Chucks for Wafer and other Substrates
- Piezo Electronic Components
- Sensors
- Windows
700 Manufacturing Services
- Machine Shop; Fabrication Service
- Micro Machining services (small hole drilling and milling)
- Sawing; Lapping; Grinding; Polishing Service