Electrodeposited AlumiPlate® Al is 99.99% pure Aluminum with no inclusions and no impurities. The coating acts as an impervious barrier to diffusion of contaminants, trace elements and corrosion products from the substrate into the process environment. It is highly resistant to reactive gases and precursors at temperatures up to 450 °C.
The Al plating can be converted to an ideal anodized layer with very high di-electric strength, corrosion resistance and a dense defect-free structure. Semifab OEM testing has shown that anodized electroplated Al is far superior to anodized Al 6061. Breakdown voltage is in excess of 2000 V per mil (1 mil is 0.001”) and process contamination is reduced by multiple orders of magnitude.
The patent-pending AlumiPlate Bond Layer ™ can be fully anodized allowing for direct plating and anodization of even the most complex chamber components.
Extend equipment life, reduce contamination, increase yields and lower maintenance costs, using AlumiPlate® aluminum.
Product Categories
101 Photovoltaic Device Manufacturing
- PV: Cells
- PV: Modules
- Solar Thermal
201 Flat Panel Display Equipment
- Anodic Oxidation Equipment
207 Process Equipment
- Coat; Develop; Resist Processing; Track Equipment
- Deposition; (CVD, PVD, ALD, Plating)
- Deposition; PVD; Sputtering; Evaporation Equipment
- Etching; Stripping; Ashing - Dry and Wet Equipment
- Ion Implantation Equipment
- Ion; E-Beam Milling Etching Equipment
- Plating; Electro Chemical Plating; Deposition Systems
307 Process Materials
- Deposition Supplies
- Deposition/Target Materials
- Plating Materials
- Process Chamber Components: Graphite; CFC; PBN
308 Substrates
- solar cell subs.; crystalline silicon (c-Si); thin film
700 Manufacturing Services
- Plating; Electro Polishing; Coating; Surface Treatment
902 Other
- Other