Continuing our tradition as a leading backend semiconductor manufacturing solutions provider, we take great pride in sharing our latest technology for Thermal Compression Bonding (TCB), Sintering, Multi Chip thin die processing and plating equipment.
We look forward to seeing you and allowing us to show you how BESI’s solutions in advanced packaging solutions can meet your manufacturing needs.
Product Categories
101 Photovoltaic Device Manufacturing
- PV: Modules
- PV: Stand-Alone Systems
- Solar Thermal
200 Packaging and Assembly Equipment
- Cut & Down Set; Trim; Form Equipment
- Deflashing; Degating Tools
- Dicing; Sawing; Scribing; Separation Equipment
- Die Bonding; Attach Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
- Dispensing Systems
- Lead Finishing; Straightening Equipment
- Molding; Encapsulation; Decapsulation Equipment
- Plating; Electro Chemical Plating for device assembly
- Wafer Level Bonders
- Wire Bonding Equipment
202 Other Equipment
- Molding; Encapsulation; Decapsulation Equipment
204 MEMS Equipment
- Wafer Level Bonders
206 PV Equipment
- Modules
- Other
700 Manufacturing Services
- Repair; Rebuild; Install Equipment; Maintenance Svcs; Spares