AMICRA is a worldwide leading supplier of Die Attach Equipment specializing in submicron placement accuracy (±0.5µm@3s). Our equipment offering supports Die Attach and Flip Chip bonding processes including the following capability: in-situ eutectic bonding, dynamic alignment, heated tool, pulse heating, laser heating, volumetric & jet dispensing, active bond force control, high speed solutions, in-situ UV curing, 550x600mm bonding area, quantitative tilt calibration system,etc. Other products: High Speed Wafer Inking & Inspection, Automated LED/LD Test & Sort Systems, Gel Fill Line & Custom Solutions. Market focus: Opto,Silicon Photonics,AOC,VSCEL,Laser Diode,WLP,TSV,TCB,Fan-Out/EWLP,2.5D/3D IC
Product Categories
200 Packaging and Assembly Equipment
- Die Bonding; Attach Equipment
- Wafer Level Bonders
204 MEMS Equipment
- Wafer Level Bonders