Accretech (Tokyo Seimitsu) is a global leader in the design and manufacture of semiconductor assembly equipment.
Accretech products have been recognized for exceptional performance and reliability.
Our products include Wafer Probing machines, Dicing Saws, Precision Dicing Blades, Polish Grinders and CMP equipment.
Product Categories
200 Packaging and Assembly Equipment
- Backgrind; Slicing; Lapping; Polishing Equipment
- Cleaning; Washing Equipment for Assembly & Packaging
- Dicing; Sawing; Scribing; Separation Equipment
208 Test Equipment
- Discrete Component Test Systems
- Handlers; Positioner Systems
- Probing: Analytical; Circuit; Manual; E-Beam; Optical; Wafer
- Test Head Manipulators and Docking Stations
300 Packaging and Assembly Materials
- Scribe Tools; Saw or Dicing Blades and Accessories
400 Components, Parts & Accessories
- Chucks for Wafer and other Substrates
701 Manufacturing Services or Consulting
- Test Services or Consulting
- Wafer Handling