Boschman Advanced Packaging Technology is the world leader of automatic molding systems that use film for the encapsulation of Sensor and MEMS devices. The process, called Film Assisted Molding, is ideal for applications where sensing surfaces, bond pads or heat sinks must be exposed and free of mold compound flash and bleed. This technology is used for MEMS, Sensors, Solar and Optical encapsulation applications using transfer molding of epoxy or silicone based mold compounds, including clear materials. Silver sintering development and systems are also available.
With our Package Development and Assembly Services we offer a one-stop shop for package research, development, qualification, prototyping and small to medium volume manufacturing focusing upon MEMS, Sensors and advanced IC and wafer level packaging applications.
Product Categories
- Automotive
- Flow
- Fluid Level
- Medical
- Moisture/Humidity
- Optical
- Presence/Proximity
- Pressure
- Sensors/System Components
- Temperature