Finetech supplies sub-micron accuracy die bonders for advanced packaging and all types of sensor assembly - medical imaging, x-ray, pressure, optical, thermal, navigation, LiDAR, fluidic, bio-sensors, detectors, and more. Process flexibility within one platform makes Finetech bonders ideal for R&D or prototype environments – thermocompression, thermosonic, eutectic, epoxy, high force (ikN), tacking / bump bonding, Indium bonding and integrated dispense.
Product Categories
- Positioning Equipment/Systems