AUVSI's Unmanned Systems 2016

3D PLUS 

Booth 573

Fremont, CA  
      United States

3D PLUS integrates electronics in 3D, enabling a high level of miniaturization. The modules are designed to address the needs of autonomous equipment: high density, wide temperature range, unmatched behavior under shock and vibration. Standard products range from wide bus DDR3 memory modules, to secure µSSD, to embedded programmable modules.