WEST•BOND offers a Wedge Bonder / Ball Bonder combination machine in three different configurations…Manual, Semi-automatic in motorized “Z”, and motorized “Z” & “Y”. WEST•BOND also manufactures a Die Bonder that combines both Epoxy and Eutectic methods in one chassis. Between these two series you can bond most any product in the microelectronic industry.
Since 1966, West Bond Inc. has been a Design and Manufacturer of Assembly and Test Equipment for the Microelectronic Industry here in Southern California. Including Automatic, Semiautomatic, and Manual ESD protected bonders, with Ultrasonic, Thermosonic, and Thermocompression Wire/Ribbon capability. Included in product line are Eutectic and Epoxy Die Bonders, Insulated Wire Bonders, and Pull Testers with our patented X-Y-Z, 8/1 ratio micromanipulator.
In addition, we design and manufacture accessories such as LED Illuminators, Heated and Cold Workholders, Temperature Controllers, and Wire Despoolers, as well as full a complement of machine shop services.
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