SEMICON Korea 2018
Tweet
Sessions
Speakers
Exhibitors
Products
Press Releases
Floor Plan
SUSS MicroTec AG
 
Profile
Products
Press Releases
XB8
Universal High-Force Wafer Bonder The XB8 wafer bonder is designed for a wide range of bonding processes and supports substrates with a wafer size of up to 200 mm. All process parameters can be adapted flexibly according to the requirements.
Profile
Products
Press Releases
Home
Sessions
Speakers
Exhibitors
Products
Press Releases
Floor Plan
Tweet
Login
|
Back to top
ChirpE