SEMICON Korea 2018

Sessions Speakers Exhibitors Products Press Releases Floor Plan

SUSS MicroTec AG 

XBS300

Universal Temporary Wafer Bonder for High Volume Manufacturing The 200/300mm platform can be configured for low cost of ownership and maximum pr... More...

XB8

Universal High-Force Wafer Bonder The XB8 wafer bonder is designed for a wide range of bonding processes and supports substrates with a wafer si... More...

MA200 Platform

Alignment and Exposure for a Multitude of Applications Especially designed for high volume production the MA200 mask aligner platform is suited ... More...

ELD300 Debonder

The ELD300 debond module supplements the SUSS MicroTec product portfolio for laser-based wafer processing. The ELD300 module is designed to debond... More...

DSC300 Gen2

Projection Scanner DSC300 Gen2 The projection scanner DSC300 Gen 2 suitable for wafer sizes up to 300mm utilizes latest technologies of projecti... More...

ACS300 Gen3

Powerful Solution for Advanced Packaging Applications The modular system of ACS300 Gen3 is specifically designed for demanding high-volume produ... More...