EDI CON USA 2018
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Surender
Singh
Surender Singh
Cadence Design System Inc.
Surender Singh received the Ph.D and M.Tech degrees in Electrical and Instrumentation Engineering and Electronic Communication Engineering from Thapar University and the IASE Deemed University, India respectively. He has17+ years’ experience in the industry, especially R/D sectors (C-DOT, Transwitch Corporation and Cadence) from 2000-20018. His interest includes the high-speed Board design, advance package design (more than 300 K bump) and to develop novel techniques for improving SI/ PI/EMC in advance packaging technology.
Sessions :
Signal Integrity Analysis on Integrated Thin Film High Density Organic Package Technology for Next Generation Applications
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