2018FLEX

Leland (Chip) Spangler
President
Aspen Microsystems


Dr. Spangler received his Ph.D. in electrical engineering from The University of Michigan in 1988 and is currently the President of Aspen Microsystems, LLC a microsystems product development and intellectual property company with specialization in semiconductor devices, packaging and assembly. Chip was previously the President and CTO of Aspen Technologies a semiconductor package design and assembly subcontracting company that provided services for customers in medical, industrial, telecom and mil-aero markets. Among these products were ultra high-resolution displays, several DNA analysis products, implantable devices for neuromodulation, and MEMS switch arrays for telecom applications. Prior to this, Chip was employed at Ford Microelectronics where he had responsibility for a number of microelectronic programs including analog IC design, pressure sensors, micro-machined fuel injectors, as well as airbag and chassis accelerometers. His work lead directly to the production of the world's first wafer-level packaged, plastic surface-mount airbag accelerometer. Dr. Spangler is the author of over 30 technical publications and 9 patents. He is currently an editor for IEEE Journal of Microelectromechanical Systems (JMEMS) and he serves on the board of directors several organizations. He has also been active in organizing a number of technical conferences including the biannual Transducers Conference as well as the Hilton Head Solid State Sensor Workshop.

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