2018FLEX
Tweet
Sessions
Speakers
Exhibitors
Products
Press Releases
Floor Plan
Buzz
Speakers
Douglas
Hackler
Douglas Hackler
President & CEO
American Semiconductor, Inc.
Mr. Hackler is President & CEO of American Semiconductor, having co-founded the company in 2001, and is a co-inventor of Semiconductor-on-Polymer technology. At American Semiconductor Doug maintains overall corporate and operational responsibilities. He is a flexible electronics industry advocate and leader who is known for his commitment to industry development of new flexible products. He has more than 30 years of experience in wafer fabrication, process development, manufacturing and commercialization at American Semiconductor, M/A-Com, Zilog, Intel, NorTel and General Instrument. Doug has served as the Principal Investigator (PI) on multiple projects, generated multiple patents and patents pending for conventional and flexible solid state technology and has published numerous technical papers. Doug holds engineering degrees from the University of Idaho (MSEE), Boise State University (BSEE) and in management from Texas Tech University (BBA).
Sessions :
Short Course 3: Flexible Device Integration & Packaging
Complex Flexible Hybrid Electronic Labels
Home
Sessions
Speakers
Exhibitors
Products
Press Releases
Floor Plan
Tweet
Login
|
Back to top
ChirpE