2018FLEX

MP Divakar
CEO
Stack Design Automation


M.P. Divakar is founder and CEO of Stack Design Automation, a company focused on developing ECAD-MCAD integration software platform, design stacks, services and training for next-generation electronics including MEMS, 3DIC, Printed Electronics, Wearable & Stretchable Electronics and the Internet-of-Things. He has more than 18 years of experience in electronic packaging development in microwave-, millimeter-wave and RF-communications, power electronics and MEMS at component-, module- and system-level applications. He has also worked on hardware development for semiconductor test and high speed communication fabric. His expertise includes electronic & optoelectronic packaging (JEDEC, IPC, MIL-STD, & Telcordia), thermal and thermo-mechanical modeling, characterization (AnalysisTech’s Phase-10 system) and finite element simulation. FEA and CAD Systems expertise include ANSYS, ICEM CFD, DesignSpace, CAEFEM, COSMOS, Comsol, NASTRAN, LSDyna, LS PrePost, ProE, AutoCAD and SolidWorks. His professional experience includes serving as the Chief Engineer, Copper Ethernet at Panduit where he led a group developing gigabit and 10Gig, 40Gig and 100Gig connectivity products. He has also worked for Power-One, Peregrine Semiconductor, InTest and Remec. He has more than 30 publications, 10 issued patents and many applications pending. He is a Senior Member of IEEE and a Fellow of the Institution of Engineers (India). He is an active contributor to EE Times and participates in the 3DIC & MEMS standards activities of SEMI and GSA. He has published several articles in the technical press and organized and chaired sessions at conferences in the Silicon Valley. He also serves as Vice Chair for the Silicon Valley Chapter of the IEEE Communications Society. He holds a PhD from Arizona State University, an MSc from The University of Calgary, and a B Eng from the University of Mysore (India).

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