SEMICON Korea 2019

Eric NG Hoi Ping
Senior Business Development Engineer
ASM Pacific Technology


Eric NG, has been business development position at ASMPT for 4 years with responsible of product marketing and development in advanced packaging sector. His main responsible area including advanced interconnect business such as flip chip bonding, TCB bonding, Fan-out wafer and panel level packaging. Prior to joining ASMPT, Eric was in engineering position for product development in semiconductor industry. During his over 10 years' experience, Eric spent time doing process and product R&D including FPC (flexible printed circuit), packing assembly and thermal cooling solution for package device. Eric received a Bachelor and Master degree in Mechanical Engineering field from Hong Kong University of Science and Technology.

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