2018FLEX

Mike Deppe
Director of Engineering
Molex


Mike Deppe is the Director of Engineering and Project Management for Molex’s Printed Circuit Solutions Business Unit. He has over 15 years of experience in printed electronics and automated assembly, with half of those years focused on profitable growth as Operations Manager. He is now leading development efforts to advance design, processing and manufacturing capabilities for hybrid electronics. Including design centers in Taiwan, China and the US, he has global product development responsibilities for Human Machine Interface (HMI) assemblies, copperflex products, printed electronics and sensor systems. Mr. Deppe earned a Bachelor of Science in Mechanical Engineering and Minor in Economics from Purdue University.

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