SEMICON Europa 2016

Teruo Hirayama
Corporate Executive/ President of Device & Material R&D Group
Sony Corporation, Device & Material R&D Group


Teruo Hirayama received a bachelor’s degree in Electrical Engineering from Waseda University, Tokyo, Japan in 1981, the same year he joined Sony Corporation. He started in the research division of the semiconductor group, where he worked on SRAM, CMOS LSI and then developed stacked wide band DRAM on LOGIC chip. He joined the image sensor division in 2002 and soon started developing back-illuminated CMOS image sensor and launched it into the market in 2009 and stacked image sensor in 2012. He became senior general manager of the semiconductor technology development division in 2010, and led the development of semiconductor devices. He became senior vice president in June 2013 and he was appointed as president of device and material R&D group on April 1, 2014, and has the responsibility for R&D of displays, batteries and material adding to semiconductor devices.

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