SEMICON Europa 2016

Thibault Buisson
Business Unit Manager, Advanced Packaging & Manufacturing
Yole Developpement


Thibault Buisson is the Business Unit Manager of the Advanced Packaging & Semiconductor Manufacturing activities at Yole Développement, the “More than Moore” market research and strategy consulting company.
Thibault graduated from Grenoble Institute of Technology (INP) with a Master’s degree of Research in Micro and Nano electronics and from Polytech Grenoble with an engineering degree in Material Sciences. He then joined NXP Semiconductors as an R&D process engineer in the thermal treatment area to develop CMOS technology devices from the 65 to 45nm nodes. Afterwards, he joined IMEC Leuven and worked for over 5 years as a process integration engineer in the field of 3D technology. He has authored or co-authored fifteen international publications in the semiconductor field and has spoken at several conferences and symposiums, including keynotes, related to Advanced Packaging.

Sessions :