SEMICON West 2016

Dave McCann
VP Packaging R+D and Business Technical Operations
GLOBALFOUNDRIES


David McCann has been at GLOBALFOUNDRIES for five years, where he is Vice President of Post Fab Operations and Development. He is responsible for bump and wafer test factories in Dresden Germany, Burlington VT, and E Fishkill NY, for outsourced bump, probe, assembly, and test operations, and advanced packaging technology development. He is based at the Fab 8 site, in Malta, New York, just north of Albany. David’s background prior to GLOBALFOUNDRIES was in flip chip technology development and business management in the OSAT industry, and prior to that, flip chip assembly and product development in implantable medical electronics.

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