SEMICON West 2016
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Dongkai
Shangguan
Dongkai Shangguan
VP & Chief Marketing Officer
STATS ChipPac
Dr. Shangguan is currently the Chief Marketing Officer of STATS ChipPAC. He joined STATS ChipPAC in 2015 after having served as the Founding CEO of the National Center for Advanced Packaging Co., Ltd. (“NCAP China”). Prior to this, he spent 11 years at Flextronics where he was Corporate Vice President of Global Advanced Technology and Engineering Leadership. Dr. Shangguan also worked for 10 years with Ford Motor Co. and Visteon Corporation where he held various technical and management responsibilities in automotive electronics. Dr. Shangguan, an IEEE Fellow, has served on the IEEE CPMT Society Board of Governors, the IPC Board of Directors and other industry groups. Dr. Shangguan received his Bachelor of Science degree in Mechanical Engineering from Tsinghua University, China; a MBA degree from San Jose State University and a Ph.D in Materials from the University of Oxford, U.K. He conducted post-doctoral teaching and research at the University of Cambridge and The University of Alabama, and is currently a Guest Professor at several universities. Dr. Shangguan has published two books, authored/co-authored 250 technical papers and articles, and has been issued over 20 patents.
Sessions :
Flex Hybrid Electronics Processing and Packaging
SiP Next 2 - IoT & Smart Things - SiP Integration
SiP Next 2 - IoT & Smart Things - SiP Integration Session Wrap-up - Dongkai Shangguan, STATS ChipPAC
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