IIoT3: IoT Enabling Flexible Circuits with Integrated Sensors, Secure Wireless Communication/Power, Advanced Chip Packaging, and Shape Memory Actuation
(Room Theater 2)
16 Oct 18
1:00 PM
-
1:50 PM
Peter Ladwig - Senior Director, Technology Development, TDK - Hutchinson Technology — Enabling IoT development by utilizing roll to roll semi-additive process technology for cost effective solutions. IoT requires sensors, actuators, wireless communication and power in a small, customized form factor. Roll to roll semi-additive manufacturing can provide some of the best processes of both PCB/flex and silicon fabrication. Roll to roll semi-additive technology enables one process technology to make the functional component integrated into the package. Such as strain gauges, RTDs and shape memory actuators.