EDI CON USA 2018

Panel: What is the Best RF Architecture for 5G ? (Room Ballroom G)

This panel of industry experts, closing out the EDI CON USA 5G Symposium, looks critically at the available design choices, including integration levels, RF partitioning tradeoffs, digital versus analog beam forming, integrated Si versus III/V devices, single chip versus multi-chip modules, and antenna structures. The panel will address questions from both the moderator and audience.