Comparison of Embedded Coplanar Waveguide and Stipline for Multi-Layer Boards
(Room Ballroom H)
17 Oct 18
1:45 PM
-
2:15 PM
In this paper, we present the comparison of conductor-backed Coplanar Waveguide (CPW) with a cover shield and stripline for multi-layer boards using a full 3D EM CAD software. It is important in high-speed digital applications to decrease the form factor and increase the signal density by reducing isolating metal layers while preserving comparable crosstalk, loss, and dispersion at the frequency of interest. Conductor, and dielectric losses of conductor-backed CPW with a cover shield and stripline are compared up to 25 GHz, for 5Gbps digital applications. Typical dimensions are used for Intel’s stripline SDRAM multilayer interconnect boards and equivalent dimensions are calculated for CPW. Isolation and coupling is presented for tightly and loosely coupled edge and broadside-coupled CPW and stripling. We show that CPW with smaller form-factor outperforms stripline in isolation and coupling.