Profiling Heat with an Integrated Coupled Electro-Thermal Simulation
(Room 209)
17 Oct 18
1:40 PM
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2:20 PM
Currently a number of electronic industry initiatives require a coupled electromagnetic with thermal heat simulations for many diverse applications. These initiatives include 5G efforts to design electronic devices/systems with more signal power both in magnitude and in distribution density and operation at higher frequencies. This means the electronic devices creating and conditioning the signal will have increased heat loads. Heat is a challenge as it can degrade the performance and reliability of these electronic devices. Every application is different; a static mechanical thermal analysis tool can be used with an electromagnetic simulation tool but if airflow about the device or system will affect the heat transfer than a fluid based thermal tool is needed. Use of integrated coupled Multiphysics simulation tools will couple the necessary electrical inputs together with a thermal solution to provide a custom and accurate simulation of the device or system under test.