Tracks: 2018 MSTC Full Conference, Emerging Technologies, Materials
MSTC 2018 Session 4: MATERIALS & CHARACTERIZATION
Wednesday February 14, 2018 ~ 11:20 - 11:50 AM
Julia received her Bachelor and Master of Science degrees from Johann-Wolfgang-Goethe University, Frankfurt. In 2015, she finished her Ph.D. in Physical Chemistry at the University of Heidelberg. Shortly after, Julia joined Sentronics Metrology in Mannheim, Germany as an applications engineer. In March 2016, she was transferred to Quantum Analytics to promote metrology equipment in the US semiconductor industry. She now works in the company’s headquarters in Foster City, California office as the applications lead.
The tremendous increase of MEMS end-market segments requires new skill sets and instrumentation that allows for studying novel designs. Maintaining performance at high yield levels, and proven long-term reliability are key. The desire to reduce noise, increase bias stability, and improve resolution relies on investigation methods that show instantaneous response in order to guarantee functionality. Digital holographic microscopy (DHM) enables measurements of 3D surface topography in real-time without the need of vertical scanning, which differentiates this technology from others like confocal microscopy or white light interferometry. A vertical scan in the z-axis leads to long data acquisition times. In contrast, the DHM can capture the entire 3D information in one single hologram. This single shot data acquisition allows for high-speed imaging at camera rate with sub-nm resolution that is insensitive to noise. Dynamic measurements of 3D topography with changes induced by a mechanical force, a chemical reaction, a temperature or pressure change, or by applying voltage to study MEMS capabilities have now become available. Moreover, digital holographic microscopy is capable of measuring through glass, liquids, gases, or vacuum, thus allowing for in-situ measurements in any environment. The ability to perform full-field measurements with high lateral and vertical resolution paves the way for investigating new product designs and optimizing geometries for next generation microelectronic devices. The application examples presented during this talk will clearly illustrate how this technology can provide sample characterization that was previously unachievable.