Session 12: FE Tools & Methods

Development of a fully Integrated, Compatible, Materials Stack for Flexible Printed Electronics
Wednesday, February 14, 2018
4:40 PM - 5:00 PM

As Sensors, Smart Packaging and other connectivity devices continue to proliferate, eventually leading to interconnected Internet of Things (IoT), it is critical to develop and deploy suitable, low cost, high speed manufacturing technologies and advanced materials. Flexible Printed Electronics is one such additive manufacturing approach that can meet this emerging need. In this paper, we take a holistic view at materials aspect of this ecosystem. We present building blocks of Flexible Printed Electronics that have been considered and developed from an integrated perspective covering: - Novel Film Substrates: New substrate materials and requirements for PET, Heat Stabilized PETs, PCs, etc. are discussed. Potential pitfalls such as substrate shrinkage, breakdown voltage and other requirements are considered and solutions offered. - Highly Conductive Inks (Silver and Carbon): Performance requirements, such as low temperature, rapid curing Inks are discussed along with its results. - High Performance Dielectrics (UV Curable and Thermally curable), and - Low Temperature Adhesives We present performance and compatibility details of each of the building block and ensure that mutual compatibility of each of the “material stack” constituent needs to be considered along with its suitability with the substrates being used.