2018FLEX

Challenges and Opportunities for 3D Printed Electronics (Room Cypress)

14 Feb 18
1:30 PM - 1:55 PM

Tracks: 2018FLEX Full Conference, Printed Electronics

Session 10: Direct Write & 3D Printing II

Challenges and Opportunities for 3D Printed Electronics
Wednesday, February 14, 2018
1:30 PM - 1:55 PM

There are advantages in using 3D printed electronics are for prototyping, lower cost, and unique manufacturing applications. Work continues in the area of ink development with many desired materials still in development. Because the industry is still in its early stages of growth for electronics applications, reliability data is limited. A major advantage of 3D printed electronics is that in-house proprietary designs never leave the building. This allows rapid innovation, experimentation with complex geometries not available in another way, flexibility, customization, security, and fast time-to-market. Limitations include droplet sizes that are not compatible with Front End Semiconductor Processes, but are compatible with Back End Semiconductor Processes (BEOL) which need features from tens of microns to millimeters. Inks with similar conductivities to traditional electronic metals are required for printed circuit applications. Mixing conductive materials with polymers to make conductive inks can result in a higher resistivity. Some conductive metals are susceptible to oxidation unless protected during processing. This presentation examines material trends and takes a look at the applications driving the adoption of 3D printed electronics.