Session 9: Flexible Electronics Applications I

Complex Flexible Hybrid Electronic Labels
Wednesday, February 14, 2018
1:30 PM - 1:55 PM

The industry has sought hybrid systems that can provide capability for monitoring and tracking environmental conditions of temperature sensitive materials like those for pharmaceuticals in the Bio-Medical industry and other perishable products. American Semiconductor, with support from NextFlex has developed a hybrid smart-label that demonstrates advanced hybrid manufacturing feasibility and working prototypes for next generation smart-labels. Results from hybrid integration of a fully flexible ultra-thin SoP IC (TRL 6), a flexible battery (TRL7) and a printed circuit and antenna inlay (TRL9) are provided. This talk shares advances in flexible ICs and hybrid assembly that includes: mounting ICs on printed substrates, device interconnection with printed materials, flexible battery integration, antenna integration, and demonstrations of a complex flexible hybrid electronic (FHE) system. • Smart Tracking Tag hybrid RFID system developed by American Semiconductor with support of NextFlex • Flexible hybrid system tracker demonstration including temperature sensor, flexible SoP IC, flexible battery, printed antenna and complete EPC Gen 2 wireless communications. • Advanced manufacturing approaches for flexible hybrid electronic assembly This presentation will show the state-of-the-art results in flexible hybrid system integration demonstrated with the Smart Tracking Tag hybrid system developed by American Semiconductor with support from NextFlex.