2018FLEX

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Short Course 1: From Lab to Fab: Materials, Printing and Processing of Flexible Hybrid Electronics (Room Spyglass)

1. From Lab to Fab: Materials, Printing and Processing of Flexible Hybrid Electronics
Mark Poliks, Binghamton University, James J. Watkins, University of Massachusetts, Amherst, Michael Mastropietro, NextFlex

This course will review the three main approaches to FHE as well as the underlying technologies required to deliver products and processes now and in the future. These three approaches include chip-on-flex, micron scale thin-film devices on flex, and sub-micron scale self-assembled/imprinted device based coatings on flex. The discussions will include fundamentals of printing, coating and patterning technologies as well as challenges associated with pick and place, attachment of thinned silicon die on flex and emerging technologies that will enable direct printing of highly integrated components and devices.  Instructors from NextFlex, Binghamton University and the University of Massachusetts at Amherst will provide a comprehensive overview of approaches, successes and trending developments in manufacturing methods for FHE. An opportunity to sign-up for a visit to NextFlex Institute will be offered to the course attendees.

Topic Description

Introduction

  • Historical Perspective and Needs

Printed Electronics from Lab to Fab

  • Selecting the right print method for an additively manufactured circuits
  • Basic performance metrics of printed conductors and functional materials
  • Introduction to various printing methods for functional inks: direct write methods: ink-jet, aerosol-jet, extrusion, micro-dispensing, and more
  • Printing methods requiring a master: screen printing, flexo, gravure, gravure offset
  • Coating methods: slot-die, Meyer rod
  • Challenges of drying and curing functional inks
Flexible Hybrid Electronics and Packaging Overview
Case Study I: Variability and Controls in Aerosol Jet Printing
Case Study II: A Flexible Hybrid Human Performance Monitor

Roll-to-Roll Processing

  • Materials and Processes
  • Substrates: plastic, metal foils, thin flexible glass
  • Coatings: metal, TCO, dielectrics, thin film semiconductors
  • Vacuum processes: PVD/sputter, plasma etch, laser ablation
  • Photolithographic patterning

Case Study III: Active & Pssive Integration on Thin Flexible Glass

  • Interposer, TFTs and Antennas
Case Study IV: Sensors on Paper

Emerging Methods and Technologies

  • Imprint Lithography
  • Spatial ALD
  • Directed self assembly
  • Nanoparticle dispersions
  • Solution-based coatings: additive driven assembly
  • Transfer printing
  • Nano-imprint patterning
Case Study V: Microfluidic Based Patch Sensors

Case Study VI: Continuous Nanofabrication Processes

  • Applications and requirements
  • Large area infrared sensors
  • Large area energy and light management with meta structures
  • Antimicrobial/super hydrophobic surfaces for biomedical devices