MEMS & Sensor Packaging Evoluation for SiP Integration
(Room Executive Ballroom C)
22 Jun 16
3:30 PM
-
4:10 PM
This presentation of MEMS and sensor packaging evolution will focus on serving smart multiple devices, smart integration in complex connected modules, and SiP. Concrete cases using new advanced packaging solutions and benefits at the system level will be discussed.
ATTENDEE BENEFITS & TAKEAWAYS:
- Understand the key challenges related to packaging and device integration
- Learn about latest developments related to sensor and MEMS packaging
- Learn about latest developments and available solutions to integrate multiple sensors and MEMS in smart miniaturized modules or SiP