Session 19: Conductors

Anisotropic Conductive Adhesives on Flexible Hybrid Electronics
Thursday, February 15, 2018
2:45 PM - 3:05 PM

The purpose of this project was to combine flexible printed circuits with a flexible chip in order to create a flexible hybrid electronic. With this kind of technology, you can have a future in which you can integrate flexible hybrid electronics in just about any system. The problem with this is that there isn’t much information out there on how to combine the two. A method that was used to approach this problem was by using anisotropic conductive adhesives to combine the chip and printed circuit. This process requires using heat and pressure, so a press was created in order to create these conditions. I was able to find an ideal heat and pressure which was 50 psi at 130 degrees Celsius. With these conditions I was able to get continuity between the circuit and chip. One chip was able to hold a voltage at a range of 0.4 to 0.8 volts. A lot of knowledge was obtained by the process that was used in this project, we quickly learned how sensitive the die was to heat and pressure. Because of this, there is still a lot more to learn about this process in order to get a flexible chip to be fully functional on a flexible printed circuit.