Session 21: Process Control

Direct digital manufacturing of human temperature monitoring device using flip chip method into silicone encapsulant
Thursday, February 15, 2018
2:45 PM - 3:05 PM

The process of 3D printing circuits usually follow: substrate, trace, chip, encapsulant order. This bottom up order only allows a thin layer of encapsulant to be printed due to the material being in liquid state before curing. Our suggested method suggests printing the encapsulant first, then placing flipped chips down and flooding more encapsulant to cover the chips but not the legs. The legs are then milled off before the conductive traces are printed followed by the substrate material to embed the circuit. This allows for a higher encapsulant to substrate ratio to allow for more flexible circuits without compromising the protection of the chips.