Accelerating Automotive Innovation with Multi-Die Systems
(Room 303A)
05 Nov 25
3:50 PM
-
4:15 PM
As the semiconductor industry embraces multi-die architectures to push the boundaries of compute performance and system efficiency in HPC, accelerators, and edge AI, these advancements are now powering the next generation of automotive electronics. The shift toward software-defined vehicles is creating new opportunities for scalable, high-performance solutions in advanced driver-assistance systems (ADAS) and in-vehicle infotainment (IVI). This presentation examines the evolving automotive landscape, emphasizing the pivotal role of multi-die solutions from early architecture to manufacturing. Attendees will gain insights into emerging industry standards, such as Universal Chiplet Interconnect Express (UCIe) with automotive-specific enhancements, and how they are enabling innovation, interoperability, and reliability across the automotive supply chain.