Controlling Sputter Processes by Optimizing Magnetic Field Guidance and System Anode Interactions
(Room Room 104-B)
02 May 19
10:00 AM
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10:20 AM
Tracks:
Large Area Coatings
Sputter deposition by magnetron sources is controlled by the plasma confined over the target surface as well as the plasma interaction with the substrates and the chamber wall / anode. There are a wide number of variations available in terms of the confinement of the plasma and distribution of the plasma in a chamber. This is governed by the power mode and magnetic field interactions with the wider environment. This talk will illustrate a range of magnetic field designs and anode interactions for DC, AC, RF and HiPIMs type power modes for both planar and rotatable magnetrons. The right approach will be shown to offer benefits for specific layers, applications and product types.