Minature Ion Beam Sputtering for Rapid Development of New Materials and Coating Devices
(Room Room 104-C)
02 May 19
4:40 PM
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5:00 PM
Tracks:
Emerging Technologies
Faster product development is a highly desirable aim for any new idea or concept, and thin film deposition field is no exception. A new trend within the semiconductor field is to move away from device development on >=200 mm wafer size, and to instead perform such work on very small ½” wafers. The ability to develop materials and functional coatings on a very small areas would enable a substantial reduction in the development costs and infrastructure required. Outside the microelectronics field, new materials of a 10mm size are more than adaquate for scientific testing.
For that purpose, an ion beam source has been developed capable of producing ion beam sputtered uniform layers of high quality onto small <12mm areas. The target materials are small and could be foils, bulk material disks, pellets, grains or powders. There is no requirement for target cooling. A pallette of these target materials can be rotated or indexed in front of the ion beam in such a way that a multilayer coating or new material multi-element compound could easily be formed. A multitude of substrates could be used so that the materials created are readily prepared for each of the required analytical techniques.