scia Systems is a global manufacturer of ion beam and plasma processing systems for the production of microelectronis, MEMS and precision optical components. For the structuring of complex multilayers in MEMS or sensor applications, highly uniform etching processes are needed. The scia Mill 200 achieves this high uniformity by ion beam etching (IBE) of the full substrate surface on wafers up to 200 mm. The system utilizes inert gases as well as reactive gases (RIBE) and also chemical assisted etching (CAIBE). In manufacturing of BAW/SAW devices frequency and thickness trimming to Angstrom precision is required. The industry proven scia Trim 200 uses the ion beam trimming (IBT) process, in which the focused ion beam, with a spot size of a few millimeters, trims the correct amount of material needed at various locations across the wafer. Ion Beam technology can be also used for very precise deposition multilayer with the scia Coat 200 by using dual ion beam deposition (DIBD).