SEMICON West 2016
Tweet
Sessions
Speakers
Exhibitors
Products
Press Releases
Floor Plan
Buzz
Trends in Advanced Packaging- Urmi Ray, Qualcomm
(
Room
TechXPOT North
)
14 Jul 16
2:15 PM
-
2:25 PM
Tracks:
Advanced Packaging Forum
Speaker(s):
Urmi Ray, Principal Engineer, Qualcomm
Home
Sessions
Speakers
Exhibitors
Products
Press Releases
Floor Plan
Tweet
Login
|
Back to top
ChirpE