Abstract:
In the comingInternet of Things (IoT) World, everythingwill be connected with each other.They are not limited toITequipment, but includes other things like machines in factories, automobiles, portable/wearable consumer products and even various type of sensors.
As the number of connected things are exploding,withmost of them continuously connecting wirelessly to the Internet, the next generation 5G wireless communicationwill be indispensable to realize the IoT World.
Thesetrends require semiconductor chipsto be assembled in various configurationsor substratesinto smaller space. Low-kprocess ICsor MEMSdevices frequently used in wearable products,are becoming more fragile. Therefore, mechanical nor thermal damage free assembly technology will be pivotal innearfuture.
We haveimplementedpractical application of world-first damage-free bondingtechnology which we call asMonsterPAC. MonsterPACoverthrows everydisadvantage of conventionalpackaging technology and providesto high mix low volume type of manufacturing factories.
Advantagesof MonsterPAC
1. Bump on Materials
It forms conductive paste bumpson substrate applyingprinting method, which makes possible to utilizematerials such as film, organic substrate andceramics and so on.
2. Damage-Free Bonding
0.1gf/bump bondingcan be accomplished:1/20 load of existing method even withoutultrasonic waves. Also first time in the world, low temperature bonding at 170˚C, much lower temperature than current 260˚C, will not give physical/thermaldamage to chipsnor substrates.
3. Chemical-Free
3 step chemical-free process of conductive paste printing, NCP coating,and chip
bonding is completed within only 2 days. Comparing to existing method of huge bump production line, its lead time is 1/3, operation cost 1/13, investment 1/35 and factory area 1/8.Itcan be appliedto high mix low volume type of production.
Thanks to the low temperature/low load flip chip bonding technologyof MonsterPAC, bonding machine can be extremely minitualized.This desk-top type machinecan not onlyflexibly deal with high mix low volume type of production, but alsomakes itpossible to produce appropriatescale production line in necessary place in a short period of time.
As wearable devices have become to lead semiconductor applicationmarket, packaging technologies and the semiconductor industry are forcedtochange themselves.
Wearable devicesfeature theirfashionability to deal with various needs for individuals with different ages, genders, countries, cultures, tastesand so on.As a result, high mix low volume type of production with agile product type conversion will be required.
MonsterPACand desk-top factory will surely create a sensation to the conventional semiconductor industry which continued to invest in huge manufacturing factories.