Tracks: Silicon Innovation Forum
Abstract:
There is need in the semiconductor industry to have thin final product to meet performance metrics that competes with the need for thicker wafers needed to handle large diameter wafers. This is a critical problem to solve across various semiconductor device applications as this has forced the Industry to grind down the expensive starting substrates leading using complex expensive processing and waste management that leads to sub-optimal device characteristics and margins. This is important particularly in rapidly growing power device Industry. AND Inc. has developed several key technologies and demonstrated the first ever Power MOSFET device that is less than 50 microns thick without grinding away the substrate. AND Inc. uses its cost-effective, proprietary and patented processes to bring together tools, process and device technologies to address this market as the lead application for this technology and further this across other semiconductor device roadmaps.