SEMICON West 2016

Best Practices for Leveling, Vibration & Relative Humidity Measurement in Wafer and Reticle Environments- Allyn Jackson, CyberOptics (Room TechXPOT South)

14 Jul 16
2:20 PM - 2:35 PM

Tracks: Advanced Manufacturing Forum - Track 1

Abstract:

Stringent manufacturing requirements and the need to maximize both yields and tool uptimes in reticle mask environments, requires best-in-class practices for leveling, vibration and humidity measurement. Whether for diagnostics, qualification or preventative maintenance, equipment engineers need to efficiently and effectively make adjustments to the tools.

Legacy methods are not real time, may cause long delays for results and are costly with downtime required to tear down the machine. By contrast, best practice methods involve collecting and displaying acceleration, vibration and humidity data in real-time, speeding equipment alignment or set-up. Real-time data also speeds equipment diagnostic processes saving valuable time and resources. Equipment engineers can also make the right adjustment time after time with objective and reproducible data that essentially enhances process uniformity. 

This discussion will review the advantages of using a wireless, real-time, wafer and reticle-like devices -  Auto Multi Sensors (AMS/AMSRR) for key measurement applications in wafer and reticle environments that delivers on three compelling bottom lines – saving time, saving expense and improving yields.